XCZU2EG-3SFVC784E

XCZU2EG-3SFVC784E

784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O0.9V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU2EG-3SFVC784E
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 759
  • Description: 784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O0.9V (Kg)

Details

Tags

Parameters
Factory Lead Time 25 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Zynq® UltraScale+™ MPSoC EG
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.Package 784-BFBGA, FCBGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.The average operating temps for this SoC meaning should be 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.In total, this SoC part has 252 I/Os.Ideally, a power supply with a voltage of 0.9V should be used.Having 784 terminations in total makes system on a chip possible.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU2EG-3SFVC784E System On Chip (SoC) applications.

  • PC peripherals
  • Automotive
  • Apple smart watch
  • Industrial AC-DC
  • Servo drive control module
  • Defense
  • Measurement testers
  • Medical
  • Flow Sensors
  • RISC-V

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