XCZU17EG-L1FFVD1760I

XCZU17EG-L1FFVD1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-L1FFVD1760I
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 370
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O0.72V (Kg)

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1760
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 308
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Manufacturer assigns package 1760-BBGA, FCBGA to this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.Tray package houses this SoC system on a chip.308 I/Os are included in this SoC part.It is recommended to use a 0.72V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 0.742V.There is a possibility that it can be powered by a power supply of at least 0.698V.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Furthermore, this SoC processor also incorporates additional features similar to ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY which are available on other SoC processors also.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU17EG-L1FFVD1760I System On Chip (SoC) applications.

  • Automotive gateway
  • Body control module
  • Test and Measurement
  • Measurement tools
  • Special Issue Information
  • Industrial robot
  • Apple smart watch
  • Cyber security for critical applications in the aerospace
  • Medical Pressure
  • Industrial automation devices

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