| Parameters |
| Factory Lead Time |
6 Weeks |
| Mount |
Surface Mount |
| Package / Case |
FBGA |
| Number of Pins |
324 |
| Published |
1996 |
| JESD-609 Code |
e1 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Terminations |
324 |
| ECCN Code |
3A991.D |
| Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| Max Operating Temperature |
70°C |
| Min Operating Temperature |
0°C |
| Additional Feature |
YES |
| HTS Code |
8542.39.00.01 |
| Subcategory |
Programmable Logic Devices |
| Technology |
CMOS |
| Terminal Position |
BOTTOM |
| Terminal Form |
BALL |
| Peak Reflow Temperature (Cel) |
250 |
| Supply Voltage |
3.3V |
| Terminal Pitch |
1mm |
| Time@Peak Reflow Temperature-Max (s) |
30 |
| Pin Count |
324 |
| Qualification Status |
Not Qualified |
| Operating Supply Voltage |
3.3V |
| Supply Voltage-Max (Vsup) |
3.6V |
| Temperature Grade |
COMMERCIAL |
| Number of I/O |
260 |
| Memory Type |
EEPROM |
| Propagation Delay |
10 ns |
| Frequency (Max) |
97MHz |
| Programmable Logic Type |
EE PLD |
| Number of Gates |
12000 |
| Number of Logic Blocks (LABs) |
32 |
| Speed Grade |
10 |
| Output Function |
MACROCELL |
| Number of Macro Cells |
512 |
| JTAG BST |
YES |
| In-System Programmable |
YES |
| Height Seated (Max) |
2.5mm |
| Length |
23mm |
| Width |
23mm |
| RoHS Status |
RoHS Compliant |
XCR3512XL-10FGG324C Overview
The mobile phone network has 512 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).It is part of the FBGA package.There are 260 I/Os on the board.324terminations have been programmed into the device.Its terminal position is BOTTOM.The device is powered by a voltage of 3.3V volts.It is a part of family [0].There are 324pins on the chip.It is also possible to find YESwhen using this device.In digital circuits, there are 12000gates, which act as a basic building block.In order to maintain high efficiency, the supply voltage should be maintained at [0].In general, it is recommended to store data in [0].The electronic part is mounted by Surface Mount.There are 324 pins on the device.3.6Vis the maximum supply voltage (Vsup).Operating temperatures should be higher than 0°C.There should be a temperature below 70°Cat the time of operation.32logic blocks (LABs) make up this circuit.There should be a lower maximum frequency than 97MHz.There are several types of programmable logic that can be categorized as EE PLD.
XCR3512XL-10FGG324C Features
FBGA package
260 I/Os
324 pin count
324 pins
32 logic blocks (LABs)
XCR3512XL-10FGG324C Applications
There are a lot of Xilinx XCR3512XL-10FGG324C CPLDs applications.
- I/O expansion
- Synchronous or asynchronous mode
- Power up sequencing
- ToR/Aggregation/Core Switch and Router
- Custom state machines
- Wide Vin Industrial low power SMPS
- Storage Cards and Storage Racks
- LED Lighting systems
- INTERRUPT SYSTEM
- Cross-Matrix Switch