| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            10 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            900-BBGA, FCBGA | 
                                        
                                                                            
                                            | Supplier Device Package | 
                                            900-FCBGA (31x31) | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~100°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Published | 
                                            2010 | 
                                        
                                                                            
                                            | Series | 
                                            Zynq®-7000 | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            4 (72 Hours) | 
                                        
                                                                            
                                            | Max Operating Temperature | 
                                            100°C | 
                                        
                                                                            
                                            | Min Operating Temperature | 
                                            -40°C | 
                                        
                                                                            
                                            | Frequency | 
                                            667MHz | 
                                        
                                                                            
                                            | Interface | 
                                            CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 
                                        
                                                                            
                                            | Number of I/O | 
                                            130 | 
                                        
                                                                            
                                            | Speed | 
                                            667MHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            256KB | 
                                        
                                                                            
                                            | Core Processor | 
                                            Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
                                        
                                                                            
                                            | Architecture | 
                                            MCU, FPGA | 
                                        
                                                                            
                                            | Data Bus Width | 
                                            32b | 
                                        
                                                                            
                                            | Core Architecture | 
                                            ARM | 
                                        
                                                                            
                                            | Max Frequency | 
                                            667MHz | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Kintex™-7 FPGA, 444K Logic Cells | 
                                        
                                                                            
                                            | RoHS Status | 
                                            Non-RoHS Compliant | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Internally, this SoC design uses the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 444K Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 130 I/Os.During operation, the wireless SoC runs at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.The SoC computing will start only if -40°C is set.This SoC system on chip operates at a maximum design temperature of 100°C.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc. 
XC7Z100-1FF900I System On Chip (SoC) applications. 
- Central inverter
 - ARM Cortex M4 microcontroller
 - RISC-V
 - Robotics
 - Keyboard
 - Networked Media Encode/Decode
 - Smart appliances
 - AC drive control module
 - Sports 
 - Wireless networking