| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            11 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            625-BFBGA, FCBGA | 
                                        
                                                                            
                                            | Surface Mount | 
                                            YES | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~100°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Series | 
                                            Zynq® UltraScale+™ MPSoC EG | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            3 (168 Hours) | 
                                        
                                                                            
                                            | Number of Terminations | 
                                            625 | 
                                        
                                                                            
                                            | HTS Code | 
                                            8542.31.00.01 | 
                                        
                                                                            
                                            | Technology | 
                                            CMOS | 
                                        
                                                                            
                                            | Terminal Position | 
                                            BOTTOM | 
                                        
                                                                            
                                            | Terminal Form | 
                                            BALL | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Supply Voltage | 
                                            0.72V | 
                                        
                                                                            
                                            | Terminal Pitch | 
                                            0.8mm | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | JESD-30 Code | 
                                            S-PBGA-B625 | 
                                        
                                                                            
                                            | Number of I/O | 
                                            128 | 
                                        
                                                                            
                                            | Speed | 
                                            500MHz, 1.2GHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            1.2MB | 
                                        
                                                                            
                                            | uPs/uCs/Peripheral ICs Type | 
                                            MICROPROCESSOR CIRCUIT | 
                                        
                                                                            
                                            | Core Processor | 
                                            Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA, WDT | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, I2C, SPI, UART/USART, USB | 
                                        
                                                                            
                                            | Architecture | 
                                            MPU, FPGA | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 
                                        
                                                                            
                                            | Height Seated (Max) | 
                                            3.43mm | 
                                        
                                                                            
                                            | Length | 
                                            21mm | 
                                        
                                                                            
                                            | Width | 
                                            21mm | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package as per the manufacturer's specifications.A 1.2MB RAM SoC chip provides reliable performance to users.Using the MPU, FPGA technique, this SoC design's internal architecture is simple.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 128 I/Os.It is advised to utilize a 0.72V power supply.In total, there are 625 terminations, which is great for system on a chip.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc. 
XAZU2EG-L1SFVA625I System On Chip (SoC) applications. 
- Medical
 - Self-aware system-on-chip (SoC)
 - Body control module
 - Keywords
 - ARM processors
 - RISC-V
 - Efficient hardware for inference of neural networks
 - Published Paper
 - Wireless sensor networks
 - Medical