VSC8664XIC-03
| Parameters | |
|---|---|
| Factory Lead Time | 5 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | BGA |
| Supplier Device Package | 256-BGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Function | Ethernet |
| Number of Circuits | 1 |
| Data Rate | 1.25 Gbps |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8664XIC-03 Overview
BGA package is used to save board space.For telecommunications equipment packing, the Tray method is used.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .During normal operation, a minimum value of -40°C is set for the temperature.100°C is set to the maximum value to ensure normal operation.
VSC8664XIC-03 Features
Available in the BGA package
VSC8664XIC-03 Applications
There are a lot of Microchip Technology VSC8664XIC-03 Telecom applications.
- BITS Timing
- NIU
- Fiber Optic Terminals
- Fault Tolerant Systems
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Wireless base stations
- Home Side Box
- Wireless Local Loop
- Digital Modems
- Digital Access Cross-connect System (DACs)