VSC8584XKS-11
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Packaging | Tray |
| Published | 2013 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 256 |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | 0°C |
| Voltage - Supply | 1V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 2.5V |
| Reach Compliance Code | unknown |
| JESD-30 Code | S-PBGA-B256 |
| Function | Ethernet |
| Temperature Grade | OTHER |
| Interface | GMII, SerDes, SPI, TBI |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8584XKS-11 Overview
In order to save space on the board, 256-BGA packages are used.For telecommunications equipment packing, the Tray method is used.There is a type Surface Mount mount for this telecom circuit.Telecommunications equipment consists of 1 circuits.1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching configuration contains 256 terminations.With 2.5V as the supply voltage, it operates.To ensure normal operation, 0°C must be set at a minimum value.Normal operation is ensured by setting 125°C to the maximum value.
VSC8584XKS-11 Features
Available in the 256-BGA package
VSC8584XKS-11 Applications
There are a lot of Microchip Technology VSC8584XKS-11 Telecom applications.
- Interfaces to DS3
- Digital Modems
- Home Gateway
- Channel Banks
- ISDN NT1/TA
- Short/Medium Loop
- T1/E1/J1 Performance Monitoring
- Private branch exchange (PBX)
- Fiber
- SDH Multiplexers