| Parameters | |
|---|---|
| Factory Lead Time | 18 Weeks | 
| Mount | Chassis Mount | 
| Mounting Type | Chassis Mount | 
| Package / Case | TO-244AB | 
| Diode Element Material | SILICON | 
| Packaging | Bulk | 
| Published | 2016 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 2 | 
| ECCN Code | EAR99 | 
| Additional Feature | UL RECOGNIZED | 
| HTS Code | 8541.10.00.80 | 
| Terminal Position | UPPER | 
| Terminal Form | UNSPECIFIED | 
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | 
| Reach Compliance Code | unknown | 
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | 
| JESD-30 Code | R-PUFM-X2 | 
| Operating Temperature (Max) | 175°C | 
| Number of Elements | 2 | 
| Element Configuration | Common Anode | 
| Speed | Standard Recovery >500ns, > 200mA (Io) | 
| Diode Type | Standard | 
| Current - Reverse Leakage @ Vr | 200μA @ 600V | 
| Voltage - Forward (Vf) (Max) @ If | 1.31V @ 200A | 
| Operating Temperature - Junction | -40°C~175°C | 
| Application | GENERAL PURPOSE | 
| Max Reverse Voltage (DC) | 600V | 
| Average Rectified Current | 200A | 
| Number of Phases | 1 | 
| Non-rep Pk Forward Current-Max | 2620A | 
| Diode Configuration | 1 Pair Common Anode | 
| Reverse Current-Max | 200μA | 
| RoHS Status | ROHS3 Compliant |