SSTUH32866EC/G,551
| Parameters | |
|---|---|
| Width | 5.5mm |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Package / Case | 96-LFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2005 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 96 |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.7V~1.9V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | 74SSTUH32866 |
| Pin Count | 96 |
| JESD-30 Code | R-PBGA-B96 |
| Qualification Status | Not Qualified |
| Number of Bits | 25, 14 |
| Logic Type | 1:1, 1:2 Configurable Registered Buffer with Parity |
| Output Polarity | TRUE |
| Trigger Type | POSITIVE EDGE |
| Propagation Delay (tpd) | 1.8 ns |
| fmax-Min | 450 MHz |
| Height Seated (Max) | 1.5mm |
| Length | 13.5mm |
SSTUH32866EC/G,551 Overview
As a packaging method, Tray is used.You can find it in package 96-LFBGA.The voltage of 1.7V~1.9V is supplied to make sure that the device is able to operate normally.Electronic parts mounted in the way of Surface Mount are referred to as this type. 0°C~70°C is set as its operating temperature.Information can be stored in the memory at the rate of 25, 14 bits.Its base part number 74SSTUH32866 identifies a number of related parts.There are 96 pins on all component boards.Through 96 terminations, signals are prevented from reflecting off the end of transmission lines.
SSTUH32866EC/G,551 Features
SSTUH32866EC/G,551 Applications
There are a lot of NXP USA Inc. SSTUH32866EC/G,551 Specialty Logic ICs applications.
- Copper and fiber optic cables connection network
- Solenoids
- Wireless smart house
- Pocket PC
- Televisions
- interconnection between computers
- Carrier phase observations
- Wireless projection application for conferences and business talks
- Digital systems
- Structural bonding