| Parameters | |
|---|---|
| Factory Lead Time | 49 Weeks |
| Mount | Surface Mount |
| Package / Case | 2-VDFN Exposed Pad |
| Number of Pins | 3 |
| Diode Element Material | SILICON |
| Operating Temperature | 175°C TJ |
| Packaging | Cut Tape (CT) |
| Published | 2010 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.80 |
| Technology | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal Position | DUAL |
| Terminal Form | C BEND |
| Peak Reflow Temperature (Cel) | 260 |
| Base Part Number | SMP1330-085 |
| Pin Count | 3 |
| JESD-30 Code | S-PDSO-C2 |
| Number of Elements | 1 |
| Max Current Rating | 200mA |
| Power Dissipation-Max | 3W |
| Element Configuration | Common Anode |
| Diode Type | PIN - Single |
| Power Dissipation | 30W |
| Case Connection | CATHODE |
| Forward Current | 200mA |
| Application | LIMITER |
| Capacitance @ Vr, F | 1pF @ 0V 1MHz |
| Reverse Voltage | 50V |
| Reverse Voltage (DC) | 50V |
| Frequency Band | HIGH FREQUENCY TO C B |
| Resistance @ If, F | 2Ohm @ 10mA 100MHz |
| Diode Capacitance-Max | 1pF |
| Minority Carrier Lifetime-Nom | 0.004 μs |
| Diode Forward Resistance-Max | 2Ohm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |