SMDB3
| Parameters | |
|---|---|
| Subcategory | DIACs |
| Max Power Dissipation | 150mW |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Current Rating | 1A |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | SMDB |
| Max Output Current | 1A |
| Number of Elements | 1 |
| Configuration | SINGLE |
| RMS Current (Irms) | 1A |
| Trigger Device Type | DIAC |
| Voltage - Breakover | 28V~36V |
| Current - Breakover | 10μA |
| Height | 950μm |
| Length | 2.9mm |
| Width | 1.3mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 7 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 8 months ago) |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | TO-236-3, SC-59, SOT-23-3 |
| Number of Pins | 3 |
| Weight | 200.998119mg |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Cut Tape (CT) |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| ECCN Code | EAR99 |
See Relate Datesheet