| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 20-SMD Module |
| Number of Pins | 20 |
| Weight | 123.008581mg |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 20 |
| Terminal Finish | GOLD OVER NICKEL |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 3.3W |
| Technology | BIPOLAR |
| Terminal Position | QUAD |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Frequency | 2.4GHz~2.5GHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 20 |
| Operating Supply Voltage | 5V |
| Temperature Grade | INDUSTRIAL |
| Number of Channels | 1 |
| Test Frequency | 2.4GHz |
| Operating Supply Current | 490mA |
| Power Dissipation | 3.3W |
| Gain | 32dB |
| Telecom IC Type | WIRELESS LAN CIRCUIT |
| RF Type | WLAN |
| Length | 6mm |
| Width | 6mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |