SDM1L30BLP-13
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 4-VDFN |
| Number of Pins | 4 |
| Diode Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 4 |
| ECCN Code | EAR99 |
| Additional Feature | HIGH RELIABILITY |
| Technology | Schottky |
| Terminal Position | BOTTOM |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Reference Standard | AEC-Q101 |
| Number of Elements | 4 |
| Diode Type | Single Phase |
| Current - Reverse Leakage @ Vr | 1mA @ 30V |
| Voltage - Forward (Vf) (Max) @ If | 420mV @ 1A |
| Forward Current | 1A |
| Output Current-Max | 1A |
| Forward Voltage | 210mV |
| Number of Phases | 1 |
| Peak Reverse Current | 1mA |
| Max Repetitive Reverse Voltage (Vrrm) | 30V |
| Peak Non-Repetitive Surge Current | 50A |
| Height | 950μm |
| Length | 6.2mm |
| Width | 4.75mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet