RPI-0226
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | Module, Flat Lead, Slot Type |
| Number of Pins | 4 |
| Operating Temperature | -30°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2008 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | Unamplified |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Power Dissipation | 80mW |
| Number of Functions | 1 |
| Output Type | Phototransistor |
| Number of Channels | 1 |
| Output Configuration | Transistor |
| Power Dissipation | 80mW |
| Forward Current | 50mA |
| Response Time | 10μs |
| Rise Time | 50μs |
| Fall Time (Typ) | 50 μs |
| Collector Emitter Voltage (VCEO) | 30V |
| Max Collector Current | 30mA |
| Sensing Distance | 0.047 (1.2mm) |
| Collector Emitter Breakdown Voltage | 30V |
| Wavelength | 800 nm |
| Max Breakdown Voltage | 30V |
| Slot Width-Nom | 2mm |
| On-state Collector Current-Nom | 30mA |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet