RM30TPM-H
| Parameters | |
|---|---|
| Mount | Chassis Mount |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Number of Pins | 5 |
| Diode Element Material | SILICON |
| Operating Temperature | -40°C~150°C TJ |
| Packaging | Bulk |
| Published | 2002 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 5 |
| Technology | Standard |
| Terminal Position | UPPER |
| Terminal Form | SOLDER LUG |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 5 |
| Qualification Status | Not Qualified |
| Number of Elements | 6 |
| Configuration | BRIDGE, 6 ELEMENTS |
| Diode Type | Three Phase |
| Current - Reverse Leakage @ Vr | 10mA @ 800V |
| Voltage - Forward (Vf) (Max) @ If | 1.2V @ 60A |
| Output Current-Max | 60A |
| Current - Average Rectified (Io) | 60A |
| Number of Phases | 3 |
| Voltage - Peak Reverse (Max) | 800V |
| RoHS Status | RoHS Compliant |
See Relate Datesheet