| Parameters | |
|---|---|
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | QFN EP |
| Number of Pins | 16 |
| Published | 2005 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 16 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | QUAD |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.5mm |
| Frequency | 300MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 16 |
| Operating Supply Voltage | 1.8V |
| Temperature Grade | INDUSTRIAL |
| Max Supply Voltage | 1.9V |
| Min Supply Voltage | 1.7V |
| Telecom IC Type | TELECOM CIRCUIT |
| Height | 950μm |
| Length | 3mm |
| Width | 3mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |