| Parameters |
| Factory Lead Time |
16 Weeks |
| Package / Case |
488-TFBGA |
| Operating Temperature |
-20°C~105°C TJ |
| Packaging |
Tray |
| Published |
2012 |
| Series |
i.MX7S |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| HTS Code |
8542.31.00.01 |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Speed |
800MHz |
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC |
| Core Processor |
ARM® Cortex®-A7, ARM® Cortex®-M4 |
| Voltage - I/O |
1.8V 3.3V |
| Ethernet |
10/100/1000Mbps (1) |
| Number of Cores/Bus Width |
1 Core 32-Bit |
| Graphics Acceleration |
No |
| RAM Controllers |
LPDDR2, LPDDR3, DDR3, DDR3L |
| USB |
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) |
| Additional Interfaces |
AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
| Co-Processors/DSP |
Multimedia; NEON™ MPE |
| Security Features |
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS |
| Display & Interface Controllers |
Keypad, LCD, MIPI |
| RoHS Status |
ROHS3 Compliant |
MCIMX7S5EVK08SD Overview
Since the microprocessor is packed in 488-TFBGA, shipping overseas is convenient. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. i.MX7S is its series number. With a core count of ARM? Cortex?-A7, ARM? Cortex?-M4, this CPU is multicore. The CPU uses LPDDR2, LPDDR3, DDR3, DDR3L RAM controllers. To serve better this microprocessor features AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART interfaces. 1.8V 3.3V is the CPU's I/O address. uPs/uCs/Peripheral ICs type is MICROPROCESSOR, RISC.
MCIMX7S5EVK08SD Features
ARM? Cortex?-A7, ARM? Cortex?-M4 Core
MCIMX7S5EVK08SD Applications
There are a lot of NXP USA Inc. MCIMX7S5EVK08SD Microprocessor applications.
- Answering machines
- Hard drives
- Smart instruments
- Multi-meter
- Fabric
- Process control devices
- 3D printers
- Walkie talkies
- Removable disks
- Vacuum cleaners