MCIMX6L2EVN10ABR
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 432-TFBGA |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Published | 2002 |
| Series | i.MX6SL |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.2V 1.8V 3.0V |
| Ethernet | 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (3) |
| Additional Interfaces | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6L2EVN10ABR Overview
Due to its 432-TFBGA packaging, it is convenient to ship overseas. Advanced packaging method Tape & Reel (TR) is used to provide high reliability. There are 1 Core 32-Bit cores/bus width on the CPU. The operating temperature around -40°C~105°C TA should be understood. This is part of the i.MX6SL series. Core-wise, this CPU has a ARM? Cortex?-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. The microprocessor features interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART for better service. There is 1.2V 1.8V 3.0V I/O running on this CPU.
MCIMX6L2EVN10ABR Features
ARM? Cortex?-A9 Core
MCIMX6L2EVN10ABR Applications
There are a lot of NXP USA Inc. MCIMX6L2EVN10ABR Microprocessor applications.
- Fire alarms
- Broadband technology, video and voice processing
- Dialysis machines (performs function of liver)
- Microwave ovens
- Microwave ovens
- Metering & measurement field
- Projectors
- Paper shredders
- Leakage current tester
- Instrument control