MCIMX6D4AVT10AER

MCIMX6D4AVT10AER

ARM? Cortex?-A9 Microprocessor i.MX6D Series 624-FBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MCIMX6D4AVT10AER
  • Package: 624-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 517
  • Description: ARM? Cortex?-A9 Microprocessor i.MX6D Series 624-FBGA, FCBGA (Kg)

Details

Tags

Parameters
Package / Case 624-FBGA, FCBGA
Operating Temperature -40°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2002
Series i.MX6D
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 1.0GHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (4)
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 3Gbps (1)
RoHS Status ROHS3 Compliant
Factory Lead Time 14 Weeks

MCIMX6D4AVT10AER Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. CPUs have 2 Core 32-Bit cores/bus width. Understand the operating temperature around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6D series. This CPU is cored with a ARM? Cortex?-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.

MCIMX6D4AVT10AER Features


ARM? Cortex?-A9 Core

MCIMX6D4AVT10AER Applications


There are a lot of NXP USA Inc. MCIMX6D4AVT10AER Microprocessor applications.

  • Copiers
  • Binding machines
  • Process control devices
  • Hard drives
  • Industrial robot
  • X-ray
  • Network application field
  • DDC control
  • Magnetic resonance imaging (MRI)
  • Hand-held metering systems

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