MC33FS6503CAE
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6503CAE Overview
It is acceptable to ship in the way of Tray .Packing in 48-LQFP Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount provides a universal mounting method.At System Basis Chip and other applications, this power management is targeted.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .As a result, this power management is powered by 1V~5V voltage.
MC33FS6503CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6503CAE Applications
There are a lot of NXP USA Inc. MC33FS6503CAEPower Management applications.
- Real-time Signal Monitoring
- Set-Top-Box
- FPGA
- Telecom Rectifiers
- SmartPhones
- Applications Processors
- System Thermal for PCs
- FPGA, DSP Core Power
- Laser TV
- Cordless Phone Base Station