| Parameters | |
|---|---|
| Surface Mount | YES |
| JESD-609 Code | e0 |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 20 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 240 |
| Number of Functions | 1 |
| Supply Voltage | 2.75V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 20 |
| JESD-30 Code | R-PBGA-B20 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Temperature Grade | INDUSTRIAL |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| Height Seated (Max) | 0.67mm |
| Length | 2.64mm |
| Width | 2.02mm |
| RoHS Status | Non-RoHS Compliant |