M2S050T-FG896I

M2S050T-FG896I

896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S050T-FG896I
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: 313
  • Description: 896 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 377 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case 896-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B896
Number of Outputs 377
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 377
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells 56340
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 31mm
Width 31mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 896-BGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series number of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.There is one thing to note about this SoC security: it combines FPGA - 50K Logic Modules.Housed in the state-of-art Tray package.In total, this SoC part has 377 I/Os.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, voltages above 1.26V are considered unsafe.There is a possibility that it can be powered by a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Having 896 terminations in total makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 377 outputs available on this SoC.In order to use system on chip, you will need a power supply of 1.2V.The SoC chip is equipped with 377 inputs.56340 logic cells are included in logic system on chips.There is a flash of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S050T-FG896I System On Chip (SoC) applications.

  • Communication network-on-Chip (cNoC)
  • Digital Media
  • Video Imaging
  • Temperature Sensors
  • Mouse
  • Sensor network-on-chip (sNoC)
  • Microprocessors
  • Special Issue Editors
  • Servo drive control module
  • Self-aware system-on-chip (SoC)

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