Parameters |
Factory Lead Time |
8 Weeks |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
896-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
896 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B896 |
Number of Outputs |
377 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
377 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
377 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 50K Logic Modules |
Number of Logic Cells |
56340 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 896-BGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series number of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.There is one thing to note about this SoC security: it combines FPGA - 50K Logic Modules.Housed in the state-of-art Tray package.In total, this SoC part has 377 I/Os.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, voltages above 1.26V are considered unsafe.There is a possibility that it can be powered by a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Having 896 terminations in total makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 377 outputs available on this SoC.In order to use system on chip, you will need a power supply of 1.2V.The SoC chip is equipped with 377 inputs.56340 logic cells are included in logic system on chips.There is a flash of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050T-FG896I System On Chip (SoC) applications.
- Communication network-on-Chip (cNoC)
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