| Parameters |
| Factory Lead Time |
18 Weeks |
| Package / Case |
525-FBGA, FCBGA |
| Operating Temperature |
-40°C~105°C |
| Packaging |
Tray |
| Published |
2002 |
| Series |
QorIQ® Layerscape |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Speed |
600MHz |
| Core Processor |
ARM® Cortex®-A7 |
| Ethernet |
GbE (2) |
| Number of Cores/Bus Width |
2 Core 32-Bit |
| RAM Controllers |
DDR3L, DDR4 |
| USB |
USB 2.0 (1) |
| Co-Processors/DSP |
Multimedia; NEON™ SIMD |
| Security Features |
Secure Boot, TrustZone® |
| SATA |
SATA 3Gbps (1) |
| RoHS Status |
ROHS3 Compliant |
LS1022AXN7EKB Overview
Since the microprocessor is packed in 525-FBGA, FCBGA, shipping overseas is convenient. Advanced packaging method Tray is used to provide high reliability. 2 Core 32-Bit cores/Bus width are present in the CPU. The operating temperature around -40°C~105°C should be understood. This is a member of the QorIQ? Layerscape series. The CPU is cored by a processor with a number of 0 cores. It has DDR3L, DDR4 RAM controllers.
LS1022AXN7EKB Features
ARM? Cortex?-A7 Core
LS1022AXN7EKB Applications
There are a lot of NXP USA Inc. LS1022AXN7EKB Microprocessor applications.
- 3D printers
- Scanners
- Information appliances (networking of household appliances)
- Digital set-top boxes
- Mobile computers
- 8. Navigation control field
- Network application field
- Medical instruments chromatographs
- Magnetic resonance imaging (MRI)
- Safety -airbags, automatic braking system (ABS)