LL4448-GS08
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Contact Plating | Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| JESD-609 Code | e0 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| HTS Code | 8541.10.00.70 |
| Capacitance | 4pF |
| Max Power Dissipation | 500mW |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Base Part Number | LL4448 |
| Pin Count | 2 |
| Number of Elements | 1 |
| Voltage | 75V |
| Element Configuration | Single |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Current | 500mA |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 5μA @ 75V |
| Power Dissipation | 500mW |
| Voltage - Forward (Vf) (Max) @ If | 720mV @ 5mA |
| Case Connection | ISOLATED |
| Forward Current | 300mA |
| Max Reverse Leakage Current | 5μA |
| Operating Temperature - Junction | -65°C~175°C |
| Max Surge Current | 2A |
| Forward Voltage | 1V |
| Max Reverse Voltage (DC) | 75V |
| Average Rectified Current | 150mA |
| Reverse Recovery Time | 8 ns |
| Peak Reverse Current | 5μA |
| Max Repetitive Reverse Voltage (Vrrm) | 100V |
| Capacitance @ Vr, F | 4pF @ 0V 1MHz |
| Peak Non-Repetitive Surge Current | 2A |
| Reverse Voltage | 75V |
| Max Forward Surge Current (Ifsm) | 2A |
| Recovery Time | 8 ns |
| Max Junction Temperature (Tj) | 175°C |
| Diameter | 1.6mm |
| Height | 1.6mm |
| Length | 3.683mm |
| Radiation Hardening | No |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet