LE58083ABGCT
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 121-LFBGA |
| Supplier Device Package | 121-LFBGA (10x10) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tape & Reel (TR) |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC) |
| Interface | PCI |
| Number of Circuits | 1 |
| RoHS Status | Non-RoHS Compliant |
LE58083ABGCT Overview
The 121-LFBGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tape & Reel (TR) is used.Telecommunications equipment is mounted with type Surface Mount.A 1-circuit composes this telecom IC .A higher supply voltage for 3.3V will improve efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.
LE58083ABGCT Features
Available in the 121-LFBGA package
LE58083ABGCT Applications
There are a lot of Microsemi Corporation LE58083ABGCT Telecom applications.
- T1/E1/J1 Multiplexer and Channel Banks
- E1 Multiplexer
- CSU/DSU E1 Interface
- Digital Access Cross-connect System (DACs)
- NIU
- Cable Modem
- Multichannel DS1 Test Equipment
- Cross Connects
- Hybrid fiber coax (HFC)
- Fiber to the Home (FTTH)