KMPC860DTCZQ50D4
| Parameters | |
|---|---|
| Package / Case | 357-BBGA |
| Operating Temperature | -40°C~95°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC860 |
| Speed | 50MHz |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (2), 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | Non-RoHS Compliant |
KMPC860DTCZQ50D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. A high level of reliability is provided by using an advanced packaging method Tray. There are 1 Core 32-Bit cores per bus width on the CPU. Understand the operating temperature around -40°C~95°C TA. This is part of the MPC8xx series. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. At 3.3V, the CPU runs its I/O. To find variants of the microprocessor, try searching with MPC860.
KMPC860DTCZQ50D4 Features
KMPC860DTCZQ50D4 Applications
There are a lot of NXP USA Inc. KMPC860DTCZQ50D4 Microprocessor applications.
- Hard drives
- Projector
- Computed Tomography (CT scan)
- Laminators
- Copiers
- Virtual reality VR robots
- Scanners
- Automatic staplers
- Mice
- Industrial robot