| Parameters |
| Package / Case |
357-BBGA |
| Operating Temperature |
0°C~70°C TA |
| Packaging |
Tray |
| Published |
1995 |
| Series |
M683xx |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Base Part Number |
MC68EN360 |
| Speed |
25MHz |
| Core Processor |
CPU32+ |
| Voltage - I/O |
3.3V |
| Ethernet |
10Mbps (1) |
| Number of Cores/Bus Width |
1 Core 32-Bit |
| Graphics Acceleration |
No |
| RAM Controllers |
DRAM |
| Additional Interfaces |
SCC, SMC, SPI |
| Co-Processors/DSP |
Communications; CPM |
| RoHS Status |
ROHS3 Compliant |
KMC68EN360VR25VL Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. Advanced packaging method Tray is used to provide high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~70°C TA should be understood. M683xx is its series number. The CPU is cored with a CPU32+ processor. DRAM RAM controllers are used by this CPU. This microprocessor is equipped with an interface of SCC, SMC, SPI. At 3.3V, the CPU runs its I/O. You can search for variants of a microprocessor with MC68EN360.
KMC68EN360VR25VL Features
CPU32+ Core
KMC68EN360VR25VL Applications
There are a lot of NXP USA Inc. KMC68EN360VR25VL Microprocessor applications.
- Traditional industrial transformation
- Printers
- Fire alarms
- DDC control
- Industrial control field
- Safety field
- Fire detection & safety devices
- Network communication, mobile communication field
- Washing machine
- Entertainment products