| Parameters | |
|---|---|
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-TQFN Exposed Pad |
| Number of Pins | 5 |
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| Series | FASTIRFET™, HEXFET® |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 5 |
| ECCN Code | EAR99 |
| Resistance | 4.4MOhm |
| Subcategory | FET General Purpose Power |
| Technology | MOSFET (Metal Oxide) |
| Terminal Position | DUAL |
| Number of Elements | 1 |
| Power Dissipation-Max | 2.8W Ta 28W Tc |
| Element Configuration | Single |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 2.8W |
| Case Connection | DRAIN |
| Turn On Delay Time | 7.8 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 4.4m Ω @ 30A, 10V |
| Vgs(th) (Max) @ Id | 2.1V @ 25μA |
| Input Capacitance (Ciss) (Max) @ Vds | 1011pF @ 13V |
| Current - Continuous Drain (Id) @ 25°C | 20A Ta |
| Gate Charge (Qg) (Max) @ Vgs | 17nC @ 10V |
| Rise Time | 30ns |
| Drain to Source Voltage (Vdss) | 25V |
| Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
| Vgs (Max) | ±20V |
| Fall Time (Typ) | 5.3 ns |
| Turn-Off Delay Time | 8 ns |
| Continuous Drain Current (ID) | 20A |
| Threshold Voltage | 1.6V |
| Gate to Source Voltage (Vgs) | 20V |
| Drain Current-Max (Abs) (ID) | 63A |
| Pulsed Drain Current-Max (IDM) | 270A |
| Avalanche Energy Rating (Eas) | 39 mJ |
| Height | 900μm |
| Length | 3.3mm |
| Width | 3.3mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |