| Parameters | |
|---|---|
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | R-PDSO-N5 |
| Number of Elements | 1 |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Number of Channels | 1 |
| Power Dissipation-Max | 3.6W Ta 156W Tc |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 3.6W |
| Case Connection | DRAIN |
| Turn On Delay Time | 9.4 ns |
| FET Type | N-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 31m Ω @ 34A, 10V |
| Vgs(th) (Max) @ Id | 5V @ 150μA |
| Input Capacitance (Ciss) (Max) @ Vds | 2300pF @ 50V |
| Current - Continuous Drain (Id) @ 25°C | 10A Ta 56A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 50nC @ 10V |
| Rise Time | 9.7ns |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Vgs (Max) | ±20V |
| Fall Time (Typ) | 3.4 ns |
| Turn-Off Delay Time | 14 ns |
| Continuous Drain Current (ID) | 56A |
| Threshold Voltage | 5V |
| Gate to Source Voltage (Vgs) | 20V |
| Drain to Source Breakdown Voltage | 150V |
| Pulsed Drain Current-Max (IDM) | 220A |
| Factory Lead Time | 12 Weeks |
| Mount | Surface Mount |
| Avalanche Energy Rating (Eas) | 230 mJ |
| Mounting Type | Surface Mount |
| Package / Case | 8-PowerTDFN |
| Max Junction Temperature (Tj) | 150°C |
| Number of Pins | 8 |
| Height | 900μm |
| Transistor Element Material | SILICON |
| Length | 6.1468mm |
| Operating Temperature | -55°C~150°C TJ |
| Width | 5.15mm |
| Packaging | Tape & Reel (TR) |
| Radiation Hardening | No |
| Published | 2011 |
| Series | HEXFET® |
| REACH SVHC | No SVHC |
| JESD-609 Code | e3 |
| RoHS Status | ROHS3 Compliant |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Lead Free | Lead Free |
| Number of Terminations | 5 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Subcategory | FET General Purpose Power |
| Technology | MOSFET (Metal Oxide) |