| Parameters | |
|---|---|
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Number of Pins | 8 |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tube |
| Published | 2004 |
| Series | HEXFET® |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Resistance | 14MOhm |
| Voltage - Rated DC | -12V |
| Technology | MOSFET (Metal Oxide) |
| Current Rating | -11.5A |
| Number of Elements | 1 |
| Power Dissipation-Max | 2.5W Ta |
| Element Configuration | Single |
| Power Dissipation | 2.5W |
| Turn On Delay Time | 8.8 ns |
| FET Type | P-Channel |
| Rds On (Max) @ Id, Vgs | 14m Ω @ 11.5A, 4.5V |
| Vgs(th) (Max) @ Id | 900mV @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 3529pF @ 10V |
| Current - Continuous Drain (Id) @ 25°C | 11.5A Tc |
| Gate Charge (Qg) (Max) @ Vgs | 38nC @ 4.5V |
| Rise Time | 8.8ns |
| Drain to Source Voltage (Vdss) | 12V |
| Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
| Vgs (Max) | ±8V |
| Fall Time (Typ) | 225 ns |
| Turn-Off Delay Time | 291 ns |
| Continuous Drain Current (ID) | -11.5A |
| Threshold Voltage | -900mV |
| Gate to Source Voltage (Vgs) | 8V |
| Drain to Source Breakdown Voltage | -12V |
| Dual Supply Voltage | -12V |
| Nominal Vgs | -900 mV |
| Height | 1.4986mm |
| Length | 4.9784mm |
| Width | 3.9878mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |