| Parameters |
| Mounting Type |
Surface Mount |
| Package / Case |
160-LFBGA |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Supply Voltage |
1.7V~1.9V |
| Base Part Number |
74SSTU32865 |
| Number of Bits |
28 |
| Logic Type |
1:2 Registered Buffer with Parity |
IDT74SSTU32865BKG Overview
Using Tray as a packaging method is common.A package called 160-LFBGA contains it.For the device to function normally, voltage 1.7V~1.9V is supplied.Electronic parts mounted using the Surface Mount method.The operating temperature is set to 0°C~70°C.Information is stored in the memory with a size of 28 bits.Its base part number 74SSTU32865 identifies a number of related parts.
IDT74SSTU32865BKG Features
IDT74SSTU32865BKG Applications
There are a lot of Renesas Electronics America Inc. IDT74SSTU32865BKG Specialty Logic ICs applications.
- Pocket PC
- Wireless projection application for conferences and business talks
- High-speed computer links
- Wireless multimedia center in smart home
- Interconnection between switches and computers
- WDM transmission
- Satellite ground stations and transmission stations
- Desktop PC
- Switching system
- Indoor ad hoc meeting