HSP50216KIZ
| Parameters | |
|---|---|
| Factory Lead Time | 13 Weeks |
| Package / Case | BGA |
| Surface Mount | YES |
| Number of Pins | 196 |
| Published | 2001 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 196 |
| Terminal Finish | MATTE TIN |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 196 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 3.45V |
| Temperature Grade | INDUSTRIAL |
| Operating Supply Current | 850mA |
| Gain | 96 dB |
| Telecom IC Type | BASEBAND CIRCUIT |
| Height Seated (Max) | 1.5mm |
| Length | 12mm |
| Width | 12mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet