HSDL-3201#021
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Mount | Surface Mount |
| Package / Case | SMD/SMT |
| Number of Pins | 8 |
| Operating Temperature | -25°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2002 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 8 |
| Terminal Finish | Tin (Sn) |
| Technology | BICMOS |
| Voltage - Supply | 2.7V~3.6V |
| Terminal Position | SINGLE |
| Orientation | Side View |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3V |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Pin Count | 8 |
| Operating Supply Voltage | 2.6V |
| Data Rate | 115.2kbps |
| Size | 7.5mmx3.35mmx2.8mm |
| Interface IC Type | INTERFACE CIRCUIT |
| Wavelength | 880 nm |
| Standards | IrDA 1.2 |
| Idle Current, Typ @ 25°C | 100μA |
| Link Range, Low Power | 20cm |
| Shutdown | Yes |
| Width | 2.5mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet