HC9P5504B-5ZX96
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Mount | Surface Mount |
| Package / Case | SOIC |
| Published | 2000 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 24 |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Max Operating Temperature | 75°C |
| Min Operating Temperature | 0°C |
| Subcategory | Analog Transmission Interfaces |
| Technology | BIPOLAR |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 24 |
| JESD-30 Code | R-PDSO-G24 |
| Qualification Status | Not Qualified |
| Temperature Grade | COMMERCIAL EXTENDED |
| Number of Circuits | 1 |
| Max Supply Voltage | 13.2V |
| Min Supply Voltage | 4.75V |
| Power Dissipation-Max | 550mW |
| Supply Current-Max | 0.006mA |
| Telecom IC Type | SLIC |
| Battery Feed | CONSTANT CURRENT |
| Hybrid | 2-4 CONVERSION |
| Battery Supply | -48 V |
| Noise-Max | 5 dBrnC |
| Width | 7.493mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet