FSB50825AT
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 23-PowerDIP Module (0.748, 19.00mm) |
| Weight | 5.99g |
| Published | 2017 |
| Series | Motion SPM® 5 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Number of Terminations | 23 |
| ECCN Code | EAR99 |
| Type | MOSFET |
| Terminal Finish | Tin (Sn) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Additional Feature | CONTROL SUPPLY VOLTAGE(VCC)= 15V |
| HTS Code | 8542.39.00.01 |
| Technology | HYBRID |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 150V |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XDMA-T23 |
| Voltage - Isolation | 1500Vrms |
| Supply Voltage-Max (Vsup) | 200V |
| Configuration | 3 Phase Inverter |
| Max Current Rating | 3.6A |
| Output Current-Max | 9A |
| Min Breakdown Voltage | 250V |
| Height Seated (Max) | 3.3mm |
| Length | 29mm |
| Width | 12mm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet