EPM570GF256C3
| Parameters | |
|---|---|
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.89V |
| Power Supplies | 1.5/3.31.8V |
| Supply Voltage-Min (Vsup) | 1.71V |
| Programmable Type | In System Programmable |
| Number of I/O | 160 |
| Propagation Delay | 5.4 ns |
| Output Function | MACROCELL |
| Number of Macro Cells | 440 |
| JTAG BST | YES |
| Voltage Supply - Internal | 1.71V~1.89V |
| Delay Time tpd(1) Max | 5.4ns |
| Number of Logic Elements/Blocks | 570 |
| Height Seated (Max) | 2.2mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2014 |
| Series | MAX® II |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Additional Feature | YES |
| HTS Code | 8542.39.00.01 |
| Subcategory | Programmable Logic Devices |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 220 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | EPM570 |
| JESD-30 Code | S-PBGA-B256 |
EPM570GF256C3 Overview
440 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The product is contained in a 256-BGA package.There are 160 I/Os on the board.There are 256 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.As the terminal position of this electrical part is [0], it serves as an important access point for passengers and freight.It is powered from a supply voltage of 1.8V.This part is part of the family [0].Trayshould be used for packaging the chip.It operates with the operating temperature of 0°C~85°C TJ to ensure its reliability.It is recommended that the chip be mounted by Surface Mount.The FPGA belongs to the MAX? II series.It is also characterized by YES.In accordance with the [0], its related parts are listed.There are 570 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.This device runs on 1.5/3.31.8Vvolts of electricity.1.89Vis the maximum supply voltage (Vsup).Ensure that the supply voltage (Vsup) exceeds 1.71V.
EPM570GF256C3 Features
256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies
EPM570GF256C3 Applications
There are a lot of Intel EPM570GF256C3 CPLDs applications.
- Digital designs
- Dedicated input registers
- ANALOG-TO-DIGITAL CONVERTOR (ADC)
- Reset swapping
- Cross-Matrix Switch
- PLC analog input modules
- Multiple DIP Switch Replacement
- Power Meter SMPS
- ON-CHIP OSCILLATOR CIRCUIT
- Bootloaders for FPGAs