| Parameters | |
|---|---|
| Supply Voltage | 1.8V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | DS3120 |
| Pin Count | 316 |
| JESD-30 Code | S-PBGA-B316 |
| Qualification Status | Not Qualified |
| Interface | Parallel/Serial |
| Operating Supply Current | 300mA |
| Telecom IC Type | FRAMER |
| Height Seated (Max) | 2.53mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 316-BGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 2006 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 316 |
| Terminal Finish | TIN LEAD |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Voltage - Supply | 2.97V~3.63V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Number of Functions | 1 |