DS3112D1
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | NOT SPECIFIED |
| Technology | CMOS |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 240 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Pin Count | 256 |
| JESD-30 Code | S-PBGA-B256 |
| Qualification Status | COMMERCIAL |
| Interface | Parallel/Serial |
| Current - Supply | 150mA |
| Telecom IC Type | FRAMER |
| Height Seated (Max) | 2.34mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
DS3112D1 Overview
In order to save space on the board, 256-BGA packages are used.For packing, Tray is used.Surface Mount is used as telecommunications equipment mounting type.Wtelecom IC's efficiencyh a high supply voltage, 3.135V~3.465V can be operated more efficiently.The operating temperature set at 0°C~70°C can offer reliable performance.Configuration of the telecom circuit shows 256 terminations.The supply voltage it operates with is 3.3V.Telecom ICs are of type FRAMER.Telecom equipment operates wit h a supply current of 150mA.A 1 function is configured when designing.A 256 telecom product's pins are designed for the configuration of that telecom product.
DS3112D1 Features
Available in the 256-BGA package
FRAMER as telecom IC type
DS3112D1 Applications
There are a lot of Rochester Electronics, LLC DS3112D1 Telecom applications.
- Fiber
- T2 Rates PCM Line Interface
- Digital Cross-connect Systems (DCS)
- Remote wireless modules
- E1 LAN/WAN Routers
- T1 Rates PCM Line Interface
- Cross Connects
- Digital Cross Connect Systems
- Fault Tolerant Systems
- ISDN Primary Rate Interfaces (PRA)