DS21Q554
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Packaging | Tray |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | NOT SPECIFIED |
| Technology | CMOS |
| Voltage - Supply | 5V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 240 |
| Supply Voltage | 5V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| JESD-30 Code | S-PBGA-B256 |
| Function | Transceiver |
| Qualification Status | COMMERCIAL |
| Operating Temperature (Max) | 70°C |
| Temperature Grade | COMMERCIAL |
| Interface | E1 |
| Number of Circuits | 4 |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
DS21Q554 Overview
In order to save space on the board, the 256-BGA package is used.Telecommunications equipment is packed in the Tray-way.A Surface Mount-mount is used for mounting the telecom circuit.Telecommunications equipment consists of 4 circuits.When 5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.In telecom switching configuration, 256 terminations are present.With 5V as the supply voltage, it operates.This telecommunication product supports a maximum operating temperature of 70°C.
DS21Q554 Features
Available in the 256-BGA package
DS21Q554 Applications
There are a lot of Rochester Electronics, LLC DS21Q554 Telecom applications.
- Multi-Line E1 Interface Cards
- Private branch exchange (PBX)
- E1 LAN/WAN Routers
- PBXs channel bank
- Frame Relay Switches and Access Devices (FRADS)
- Hybrid fiber coax (HFC)
- E1 Network Equipment
- Integrated Multi-Service Access Platforms (IMAPs)
- Short/Medium Loop
- Residential Gateways