| Parameters | |
|---|---|
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Surface Mount | NO |
| Diode Element Material | SILICON |
| Packaging | Tray |
| Published | 1999 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Terminal Position | UPPER |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XUFM-X6 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 6 |
| Speed | Standard Recovery >500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 5mA @ 1600V |
| Voltage - Forward (Vf) (Max) @ If | 1.44V @ 100A |
| Case Connection | ISOLATED |
| Forward Current | 100A |
| Operating Temperature - Junction | 150°C Max |
| Output Current-Max | 104A |
| Halogen Free | Not Halogen Free |
| Voltage - DC Reverse (Vr) (Max) | 1600V |
| Current - Average Rectified (Io) | 60A |
| Number of Phases | 3 |
| Max Repetitive Reverse Voltage (Vrrm) | 1.6kV |
| Rep Pk Reverse Voltage-Max | 1600V |
| Diode Configuration | 3 Independent |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |