| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Surface Mount | NO |
| Diode Element Material | SILICON |
| Operating Temperature | -40°C~150°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Series | EconoPACK™2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 19 |
| Technology | Standard |
| Terminal Position | UPPER |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XUFM-X19 |
| Number of Elements | 6 |
| Configuration | BRIDGE, 6 ELEMENTS WITH BUILT-IN IGBT |
| Diode Type | Three Phase |
| Current - Reverse Leakage @ Vr | 5mA @ 1600V |
| Voltage - Forward (Vf) (Max) @ If | 2.15V @ 35A |
| Output Current-Max | 105A |
| Current - Average Rectified (Io) | 35A |
| Number of Phases | 3 |
| Non-rep Pk Forward Current-Max | 650A |
| Voltage - Peak Reverse (Max) | 1.6kV |
| RoHS Status | ROHS3 Compliant |