| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Contact Material | Tin |
| Mount | PCB, Surface Mount |
| Mounting Type | Surface Mount, MLCC |
| Package / Case | 0805 (2012 Metric) |
| Terminal Shape | WRAPAROUND |
| Number of Pins | 2 |
| Dielectric Material | Ceramic |
| Operating Temperature | -55°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2005 |
| Series | SMD Comm C0G |
| Size / Dimension | 0.079Lx0.049W 2.00mmx1.25mm |
| Tolerance | ±5% |
| JESD-609 Code | e3 |
| Feature | Low ESL |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | SMD/SMT |
| ECCN Code | EAR99 |
| Temperature Coefficient | C0G NP0 |
| Applications | General Purpose |
| Capacitance | 150pF |
| Voltage - Rated DC | 50V |
| Packing Method | TR, PAPER, 7 INCH |
| Depth | 1.25mm |
| Case Code (Metric) | 2012 |
| Case Code (Imperial) | 0805 |
| Lead Pitch | 750μm |
| Dielectric | NP0 |
| Temperature Characteristics Code | C0G |
| Multilayer | Yes |
| Voltage | 50V |
| Dissipation Factor | 0.1 % |
| Height | 1.45mm |
| Thickness (Max) | 0.035 0.88mm |
| Thickness | 889μm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |