| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Contact Plating | Tin |
| Mounting Type | Surface Mount |
| Package / Case | 3-XFDFN |
| Number of Pins | 3 |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Technology | MOSFET (Metal Oxide) |
| Pin Count | 3 |
| Number of Elements | 1 |
| Power Dissipation-Max | 360mW Ta 2.7W Tc |
| Element Configuration | Single |
| Power Dissipation | 715mW |
| Turn On Delay Time | 13 ns |
| FET Type | P-Channel |
| Rds On (Max) @ Id, Vgs | 7.5 Ω @ 100mA, 10V |
| Vgs(th) (Max) @ Id | 2.1V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 36pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 230mA Ta |
| Gate Charge (Qg) (Max) @ Vgs | 0.35nC @ 5V |
| Rise Time | 11ns |
| Drain to Source Voltage (Vdss) | 50V |
| Drive Voltage (Max Rds On,Min Rds On) | 10V |
| Vgs (Max) | ±20V |
| Fall Time (Typ) | 25 ns |
| Turn-Off Delay Time | 48 ns |
| Continuous Drain Current (ID) | 230mA |
| Gate to Source Voltage (Vgs) | 20V |
| Max Dual Supply Voltage | -50V |
| Drain to Source Breakdown Voltage | -50V |
| RoHS Status | ROHS3 Compliant |