BSP88H6327XTSA1
| Parameters | |
|---|---|
| Number of Elements | 1 |
| Number of Channels | 1 |
| Power Dissipation-Max | 1.8W Ta |
| Power Dissipation | 1.8W |
| Turn On Delay Time | 3.6 ns |
| FET Type | N-Channel |
| Rds On (Max) @ Id, Vgs | 6Ohm @ 350mA, 10V |
| Vgs(th) (Max) @ Id | 1.4V @ 108μA |
| Halogen Free | Halogen Free |
| Input Capacitance (Ciss) (Max) @ Vds | 95pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 350mA Ta |
| Gate Charge (Qg) (Max) @ Vgs | 6.8nC @ 10V |
| Rise Time | 3.5ns |
| Drain to Source Voltage (Vdss) | 240V |
| Drive Voltage (Max Rds On,Min Rds On) | 2.8V 10V |
| Vgs (Max) | ±20V |
| Fall Time (Typ) | 18.9 ns |
| Turn-Off Delay Time | 17.9 ns |
| Continuous Drain Current (ID) | 350mA |
| Gate to Source Voltage (Vgs) | 20V |
| Max Dual Supply Voltage | 240V |
| Drain to Source Breakdown Voltage | 240V |
| Input Capacitance | 76pF |
| Drain to Source Resistance | 6Ohm |
| Rds On Max | 600 mΩ |
| Height | 1.6mm |
| Length | 6.5mm |
| Width | 3.5mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 10 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | TO-261-4, TO-261AA |
| Number of Pins | 4 |
| Supplier Device Package | PG-SOT223-4 |
| Weight | 250.212891mg |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2008 |
| Series | SIPMOS® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Technology | MOSFET (Metal Oxide) |
See Relate Datesheet