Parameters | |
---|---|
Factory Lead Time | 18 Weeks |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerTDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Cut Tape (CT) |
Published | 2013 |
Series | OptiMOS™ |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Subcategory | FET General Purpose Power |
Max Power Dissipation | 1W |
JESD-30 Code | R-PDSO-N6 |
Number of Elements | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2.5W |
Case Connection | DRAIN SOURCE |
FET Type | 2 N-Channel (Dual) Asymmetrical |
Rds On (Max) @ Id, Vgs | 3.2m Ω @ 20A, 10V |
Vgs(th) (Max) @ Id | 2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1600pF @ 12V |
Current - Continuous Drain (Id) @ 25°C | 18A 30A |
Gate Charge (Qg) (Max) @ Vgs | 12nC @ 4.5V |
Rise Time | 5.4ns |
Fall Time (Typ) | 4 ns |
Turn-Off Delay Time | 25 ns |
Continuous Drain Current (ID) | 30A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 25V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate, 4.5V Drive |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |