BAS81-GS18
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Contact Plating | Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q101 |
| JESD-609 Code | e2 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver (Sn/Ag) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -65°C |
| HTS Code | 8541.10.00.70 |
| Capacitance | 1.6pF |
| Subcategory | Rectifier Diodes |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 260 |
| Current Rating | 30mA |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Pin Count | 2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 200nA @ 40V |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 15mA |
| Case Connection | ISOLATED |
| Forward Current | 30mA |
| Max Reverse Leakage Current | 200nA |
| Operating Temperature - Junction | 125°C Max |
| Max Surge Current | 500mA |
| Output Current-Max | 0.03A |
| Current - Average Rectified (Io) | 30mA DC |
| Forward Voltage | 1V |
| Max Reverse Voltage (DC) | 40V |
| Average Rectified Current | 30mA |
| Peak Reverse Current | 200nA |
| Max Repetitive Reverse Voltage (Vrrm) | 40V |
| Capacitance @ Vr, F | 1.6pF @ 1V 1MHz |
| Peak Non-Repetitive Surge Current | 500mA |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet