| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-UFDFN Exposed Pad |
| Manufacturer Package Identifier | C04-21355-Q4B |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| Series | CryptoAuthentication™ |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| Type | Authentication Chip |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Applications | Networking and Communications |
| Technology | CMOS |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | ATECC508A |
| JESD-30 Code | R-PDSO-N8 |
| Temperature Grade | INDUSTRIAL |
| Interface | I2C, Serial |
| Max Supply Voltage | 5.5V |
| Min Supply Voltage | 2V |
| Access Time | 550 ns |
| Max Frequency | 1MHz |
| Ambient Temperature Range High | 85°C |
| Height | 600μm |
| Length | 3mm |
| Width | 2mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |