| Parameters | |
|---|---|
| Mount | Chassis Mount |
| Mounting Type | Chassis Mount |
| Package / Case | SP1 |
| Number of Pins | 1 |
| Diode Element Material | SILICON |
| Operating Temperature | -40°C~150°C TJ |
| Packaging | Bulk |
| Published | 2007 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 12 |
| Terminal Finish | TIN SILVER COPPER |
| Technology | Standard |
| Terminal Position | UPPER |
| Terminal Form | THROUGH-HOLE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 12 |
| Qualification Status | Not Qualified |
| Number of Elements | 6 |
| Configuration | BRIDGE, 6 ELEMENTS |
| Diode Type | Three Phase |
| Current - Reverse Leakage @ Vr | 20μA @ 1600V |
| Voltage - Forward (Vf) (Max) @ If | 1.3V @ 70A |
| Case Connection | ISOLATED |
| Output Current-Max | 70A |
| Current - Average Rectified (Io) | 70A |
| Number of Phases | 3 |
| Non-rep Pk Forward Current-Max | 600A |
| Voltage - Peak Reverse (Max) | 1.6kV |
| RoHS Status | RoHS Compliant |