APR35-35-15CB/A01

APR35-35-15CB/A01

Heat Sink Passive BGA Pin Array Adhesive Nylon 2.9C/W Black Anodized


  • Manufacturer: CTS Thermal Management Products
  • Origchip NO: 221-APR35-35-15CB/A01
  • Package: -
  • Datasheet: PDF
  • Stock: 847
  • Description: Heat Sink Passive BGA Pin Array Adhesive Nylon 2.9C/W Black Anodized (Kg)

Details

Tags

Parameters
Factory Lead Time 14 Weeks
Material Aluminum Alloy
Shape Square, Pin Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Black Anodized
Series APR
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.575 14.60mm
Thermal Resistance @ Forced Air Flow 2.97°C/W @ 200 LFM
Thermal Resistance @ Natural 10.60°C/W
Length 1.366 34.70mm
Width 1.366 34.70mm
RoHS Status RoHS Compliant
See Relate Datesheet

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