89HT0816PYDBCGI
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Number of Pins | 196 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 196 |
| Length | 15mm |
| Width | 15mm |
| Thickness | 1.4mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
89HT0816PYDBCGI Overview
The device has a total of 196pins.A device's operation is controlled by the 196pins.By [0], it is mounted.For optimum reliability, it operates at a temperature of [0].In order to maintain consistency, a maximum value of 85°Cis recommended.
89HT0816PYDBCGI Features
89HT0816PYDBCGI Applications
There are a lot of Integrated Device Technology (IDT) 89HT0816PYDBCGI Specialized Interface ICs applications.
- Voice over IP/DSL – Integrated Access Devices, Smart
- DVD-R
- E1 Network Equipment
- Modems
- Imaging
- Low-Voltage
- Isolation
- ?Digital access cross connects
- Relay Replacement
- Microprocessor Controlled Analog Systems